• 8 In-house Designed Superconductive Composite Heat Pipes: 8 In-house designed superconductive composite heat pipes utilize a groove and powder wick structure with dual variable thickness for optimal heat transfer efficiency.
• Performance Dual Tower: The redesigned dual tower maximizes performance and surface area by incorporating optimized fin density and thickness.
• 8 Heat Pipe Array: An optimized layout comprising of 8 heat pipes ensures efficient heat transfer across the entire fin area for effective dissipation.
• Expanded Copper Base: The expanded nickel-plated copper base ensures seamless contact and complete coverage, targeting all heat zones. Minimized base layer thickness enhances heat conductivity, reduces cooler height, and improves case compatibility.
• Dual Mobius Fans: Equipped with dual variable Mobius fans, providing exceptional silence without compromising performance.
• Maximum RAM Clearance: 120mm Mobius fan provides 42mm of RAM clearance to fit a wider range of builds without sacrificing performance.